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SOURCE Texas Instruments
DALLAS, March 1, 2018 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN) today introduced several new power management chips that enable designers to boost efficiency and shrink power-supply and charger solution sizes for personal electronics and handheld industrial equipment.
Operating at up to 1 MHz, TI's new chipset combines the UCC28780 active clamp flyback controller and the UCC24612 synchronous rectifier controller to help cut the size of power supplies in AC/DC adapters and USB Power Delivery chargers in half. For battery-powered electronics that need maximum charging efficiency in a small solution size, the bq25910 6-A three-level buck battery charger enables up to a 60 percent smaller-solution footprint in smartphones, tablets and electronic point-of-sale devices.
"Consumers want faster charging in a smaller footprint. These new solutions not only accomplish that, but also enable designers to do more than they could before with less power," said Steve Lambouses, TI vice president, High Voltage Power.
Explore these new power-management devices and learn about other ways TI is giving engineers the power to innovate, design and learn by visiting booth No. 501 at the Applied Power Electronics Conference (APEC) in San Antonio, Texas, March 4-8, 2018.
Active clamp flyback chipset meets modern efficiency standards
Designed to work with both gallium nitride (GaN) and silicon (Si) FETs, the UCC28780's advanced and adaptive features enable the active clamp flyback topology to meet modern efficiency standards. With multimode control that changes the operation based on input and output conditions, pairing the UCC28780 with the UCC24612 can achieve and maintain high efficiency at full and light loads. For more information, see www.ti.com/UCC28780-pr and www.ti.com/UCC24612-pr.
Three-level buck battery charger enables higher charging efficiency
Leveraging an innovative three-level power-conversion technology, the bq25910 enables up to 50 percent faster charging compared to conventional architectures by dramatically reducing thermal loss. For more information, see www.ti.com/bq25910-pr.
Pricing, package and availability
All of these new devices are available today with pricing, package and evaluation module availability as listed in the following table.
for 1,000-unit quantities
Small outline integrated circuit (SOIC) and quad flat no-lead (QFN)
Small outline transistor (SOT)-23
Wafer chip-scale package (WCSP)
Evaluation module (EVM)
Learn more about TI's innovative portfolio of power ICs, tools and training
About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog integrated circuits (ICs) and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping approximately 100,000 customers transform the future, today. Learn more at www.ti.com.
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